EMI Suppression at High Temperatures
High-Reliability EMI Shielding Film for FPCs
WILMINA®
SF-HR5600-C
Overview
As automotive electronics become increasingly sophisticated, the growing number of sensors and electronic components makes reliable electromagnetic interference (EMI) suppression essential. Shielding films used in automotive flexible printed circuits (FPCs) must maintain stable electrical connections and adhesion even under demanding conditions, including prolonged exposure to high temperatures and repeated temperature changes.
TATSUTA’s WILMINA® SF-HR5600-C is a high-reliability EMI shielding film designed for automotive applications. Its heat-resistant conductive adhesive provides stable connection resistance and adhesion at temperatures up to 125 °C. The film also offers shielding performance and processability comparable to the standard SF-PC5600-C, making it suitable for FPCs used in demanding automotive environments.
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● High-Temperature Storage Test (125 °C for 2,000 Hours)
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Joint Resistance 
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Peel Strength 
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● Thermal Cycling Test (−60 °C to 125 °C, 30 min, 2,000 Cycles)
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Joint Resistance 
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Peel Strength 
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The results above demonstrate the high-temperature reliability of SF-HR5600-C. The film maintains stable joint resistance and peel strength after 2,000 hours of storage at 125 °C and 2,000 thermal cycles between −60 °C and 125 °C.
These characteristics make SF-HR5600-C a suitable EMI shielding solution for automotive FPCs that require reliable performance under severe temperature conditions.
* All data and numerical values shown above are measured results and are not guaranteed specifications.
