Thinner Multilayer FPC Designs
Ultrathin EMI Shielding Films for FPCs
WILMINA®
SF-PC®5900-C / SF-PC®8900-C
Overview
As smartphones, laptops, and other electronic devices become thinner and lighter, reducing the thickness of flexible printed circuits (FPCs) is increasingly important. TATSUTA’s WILMINA® ultrathin EMI shielding films help meet these requirements by providing effective electromagnetic shielding with minimal added thickness. Applying a shielding film to a double-sided FPC enables a pseudo-multilayer structure, offering an alternative to conventional multilayer FPC designs and supporting thinner, more compact electronic devices.
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Conventional Three-Layer FPC
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Double-Sided FPC with EMI Shielding Film
By applying an EMI shielding film to a double-sided FPC, a pseudo-multilayer structure can be achieved while reducing the overall thickness of the assembly. SF-PC®5900-C and SF-PC®8900-C are both just 8 µm thick after pressing, making them ideal for applications requiring ultrathin FPC designs.
Examples of Use
● SF-PC®8900-C offers improved high-frequency shielding performance while maintaining an ultrathin 8 µm profile. It also exhibits lower insertion loss than the conventional SF-PC®5600-C under the measurement conditions shown below, making it suitable for long FPCs used in laptops, tablets, and other high-speed electronic devices.
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● Insertion Loss (S-Parameter: Sdd21)
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* All data and numerical values shown above are measured results and are not guaranteed specifications.
