As automotive electronics become more complex, effective electromagnetic interference (EMI) suppression is increasingly important. TATSUTA’s WILMINA® shielding films and conductive bonding films help ensure reliable performance in demanding automotive environments, including exposure to high temperatures and humidity.
Solutions
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Solution 01EMI suppression at surface steps
● Structure of SF-PC®5600-C● Structure of the SF-PC®6000 Series
Our shielding films conform to surface steps on rigid-flex FPCs, helping provide reliable EMI suppression across uneven surfaces.
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Solution 02High-temperature conductive bonding
● High-temperature reliability testing (125 °C)
Our conductive bonding films maintain stable electrical connections and strong adhesion under demanding high-temperature conditions.
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Solution 03EMI suppression for high-speed FPCs
● Electric-field shielding effectiveness (KEC method)● Magnetic-field shielding effectiveness (KEC method)
High-performance shielding films help suppress electromagnetic noise in high-speed FPCs while supporting high-frequency signal transmission.
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Solution 04EMI suppression at high temperatures
● High-temperature reliability testing (125 °C, 2,000 hours)
Heat-resistant shielding films provide reliable electrical connections and adhesion for automotive FPCs exposed to high temperatures.
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Related Products
EMI Shielding Films
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EMI shielding films for high-speed FPCs
(high shielding performance / shape retention)WILMINA®
SF-PC®3300-C
SF-PC®3300R6 -CUL 94 V-0 (when combined with Kapton® 50H)
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EMI shielding films for high-speed FPCs
(ultrathin / high shielding performance)WILMINA®
SF-PC®3900R1 -C
SF-PC®3900R2 -CUL 94 VTM-0 (when combined with Kapton® 50H)
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EMI shielding film for FPCs
(high-reliability type)WILMINA®
SF-HR5600-CUL 94 VTM-0 (when combined with Kapton® 50H)
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EMI shielding films for rigid-flex PCBs
(high step conformability)WILMINA®
SF-PC®6000-U1N2
SF-PC®6000-U1-USUL 94 VTM-0 (when combined with Kapton® 50H)
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EMI shielding films for high-speed FPCs
(standard / ultrathin)WILMINA®
SF-PC®8600-C
SF-PC®8900-CUL 94: SF-PC®8600-C: V-0 / SF-PC®8900-C: VTM-0 (when combined with Kapton® 50H)
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Conductive Bonding Films
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Thermosetting conductive bonding films
WILMINA®
CBF®-300 / CBF®-300-W6
CBF®-800-D40 / CBF®-800-D60UL 94 VTM-0 (when combined with Kapton® 200H; CBF®-800-D40 / CBF®-800-D60)
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Thermosetting conductive bonding films
(high-reliability type)WILMINA®
CBF®-900-D40 / CBF®-900-D60UL 94 VTM-1 (when combined with Kapton® 200H)
View details
* Kapton® is a registered trademark of an affiliate of Qnity Electronics, Inc.
WILMINA, SF-PC, SF-FT, SF-CA, CBF, FGF, FGBF and TEFS are trademarks or registered trademarks of TATSUTA ELECTRIC WIRE & CABLE CO., LTD. in Japan, the United States and other countries.
