Solution
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Solution 01Noise suppression measures for steps
●Structural drawing of the SF-PC5600-C●Structural drawing of the SF-PC®6000-U1/U1N
With the full-scale introduction of 5G that enables high-capacity, low latency, and multiple simultaneous connections, the time is near when various things will be connected wirelessly.
click here.
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Solution 02Conductive bonding under high temperature
●Reliability test (left at high temperature (125℃) for 2,000 hours)
With the full-scale introduction of 5G that enables high-capacity, low latency, and multiple simultaneous connections, the time is near when various things will be connected wirelessly.
click here.
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Solution 03Noise suppression measures for high speed signal transmission FPC
●Electric field shield effectiveness by KEC method●Magnetic field shield effectiveness by KEC method
With the full-scale introduction of 5G that enables high-capacity, low latency, and multiple simultaneous connections, the time is near when various things will be connected wirelessly.
click here.
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Solution 04Noise suppression measures under high temperature
●Reliability test (left at high temperature (125℃) for 2,000 hours)
With the full-scale introduction of 5G that enables high-capacity, low latency, and multiple simultaneous connections, the time is near when various things will be connected wirelessly.
click here.
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“WILMINA”, ”SF-PC”, ”SF-FT”, ”SF-CA”, ”CBF”, ”FGF”, ”FGBF”, ”TEFS” are trademarks or
registered trademarks of TATSUTA ELCTRIC WIRE & CABLE CO., LTD in Japan, the United States and other countries.
