EMI Shielding Film for High-Speed FPCs
(High Shielding Performance / Shape Retention)

WILMINA®
SF-PC®3300-C
SF-PC®3300R6 -C

UL 94 V-0 (when combined with Kapton® 50H)
* Kapton® is a registered trademark of an affiliate of Qnity Electronics, Inc.

Product Overview

With the full-scale rollout of 5G services, the adoption of electronic devices supporting high-frequency and high-speed transmission is accelerating. As a result, FPCs used in these devices require a high level of electromagnetic noise suppression. SF-PC3300R6 -C and SF-PC3300-C offer some of the highest shielding performance in the TATSUTA product lineup and are ideal for noise suppression in high-frequency applications.

Features

High shielding performance and excellent high-speed transmission characteristics

Model Shielding effectiveness Insertion loss
1 GHz 10 GHz 1 GHz 10 GHz
SF-PC®3300-C Over 80 dB Over 90 dB Below 2 dB Below 8 dB
SF-PC®3300R6 -C Over 100 dB Over 100 dB Below 2 dB Below 8 dB
Excellent shape retention

SF-PC3300R6 -C incorporates 6 µm rolled annealed (RA) copper foil to reduce FPC spring-back during and after assembly.

Model	Shielding effectiveness	Insertion loss
1 GHz	10 GHz	1 GHz	10 GHz
SF-PC®3300-C	Over 80 dB	Over 90 dB	Below 2 dB	Below 8 dB
SF-PC®3300R6 -C	Over 100 dB	Over 100 dB	Below 2 dB	Below 8 dB

EMI Shielding Film for High-Speed FPCs<br> (High Shielding Performance / Shape Retention)

Main specifications

Item		SF-PC®3300-C	SF-PC®3300R6 -C
Transfer film thickness		50 µm	50 µm
Product thickness (after pressing)		17 µm	22 µm
Structure thickness (after pressing)	Protection layer thickness	6 µm	6 µm
	Shielding layer thickness	2 µm	6 µm
	Anisotropic conductive adhesive layer thickness	9 µm	10 µm
Adhesion strength	Adherend: Polyimide	3.0 N/cm or more	3.0 N/cm or more
Shelf life (refrigerated)		6 months	10 months