Conductive Bonding Films
WILMINA®
Thermosetting Conductive Bonding Film
(High-Reliability Type)
WILMINA®
CBF®-900-D40/-D60
UL 94 VTM-1 (when combined with Kapton® 200H)
* Kapton® is a registered trademark of an affiliate of Qnity Electronics, Inc.
Product Overview
This product maintains excellent connection reliability and adhesive strength even after 2,000 hours at 85℃/85% RH, while also providing improved embedding performance during vacuum quick pressing.
Features
-
Excellent adhesion to various materials
Provides excellent adhesion to metallic stiffeners and a wide range of other adherends. -
GND reinforcement
Electrically connects the FPC GND circuit to a metallic stiffener, enabling GND reinforcement in component-mounting areas. -
Excellent high-temperature and high-humidity resistance
Provides stable connection reliability and peel strength even after environmental testing at 85℃/85% RH.
Main specifications
| Item | CBF®-900-D40 | CBF®-900-D60 | |
|---|---|---|---|
| Separator film thickness | 50 µm | 50 µm | |
| Product thickness | Before pressing | 42 µm | 60 µm |
| After pressing | 32 µm | 49 µm | |
| Adhesion strength | Adherend: Ni-SUS | 8.0 N/cm or more | 8.0 N/cm or more |
| Adherend: Polyimide | 8.0 N/cm or more | 8.0 N/cm or more | |
| Shelf life (refrigerated) | 8 months | 6 months | |
Examples of Use
Automotive applications
Adopted in a development project by TDK Corporation.
Reference data
High-temperature and high-humidity test: 85℃/85% RH, 2,000 hours
-
・Joint resistance
-
・Peel strength
* All data and numerical values shown above are measured values and are not guaranteed values.
