High-Temperature Conductive Bonding
Thermosetting Conductive Bonding Films
WILMINA®
CBF® Series
Overview
As automotive electronics become more advanced, the number of sensors and electronic components continues to increase, making reliable grounding and electrical connections increasingly important. TATSUTA’s WILMINA® CBF series consists of thermosetting conductive bonding films with a proven track record in bonding stiffeners used to mount camera modules and board-to-board (B-to-B) connectors on flexible printed circuits (FPCs). The films provide stable electrical connections between metallic stiffeners and FPC ground circuits while maintaining excellent adhesion and electrical performance after thermal processes such as reflow. Their heat resistance and reliability also make them suitable for demanding automotive applications.
● High-temperature storage test (125 °C for 1,000 hours): Joint resistance
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CBF®-800-D60 
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CBF®-900-D60 
Both products maintain stable joint resistance after exposure to high temperatures.
● High-temperature storage test (125 °C for 1,000 hours): Peel strength (adherend: polyimide)
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CBF®-800-D60 
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CBF®-900-D60 
Both products retain high peel strength after high-temperature storage.
* All data and numerical values shown above are measured results and are not guaranteed specifications.
Examples of Use
Automotive Applications
Used in a development project by TDK Corporation.
