Conductive bonding under high temperature
Thermal setting conductive bonding film
WILMINA®CBF series
Overview
With the full-scale introduction of 5G that enables high-capacity, low latency, and multiple simultaneous connections, the time is near when various things will be connected wirelessly. In the automotive field, it is expected that sensors and other electronic components will increase in line with improvements in autonomous driving technology, where noise suppression measures is becoming increasingly important. The CBF series has a proven record in the use of bonding stiffeners when mounting conventional smartphone or other camera modules and B2B connectors to FPC, and its adoption in in-vehicle applications has also expanded due to the preference for its heat resistance, in which the characteristics do not easily change even after components are mounted.
● Reliability test (left at high temperature (125°C) for 1,000 hours); joint resistance value
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CBF-800-D60 
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CBF-900-D60 
Stable joint resistance values are demonstrated even under the high-temperature environment.
● Reliability test (left at high temperature (125°C) for 1,000 hours); peeling strength (vs. polyimide)
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CBF-800-D60 
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CBF-900-D60 
High adhesive strength is maintained even after high-temperature environmental test.
* Above data and numerical values are all actual measurement values, not guaranteed values.
Examples of Use
