High density wiring design of FPC
Free grounding film (for shielding film)FGF®-500
Free ground bonding film (for shielding film)FGBF®-700
In order to maximize the shield effect, optimum grounding (multiple point ground) is required, while on the other hand it is difficult to secure a sufficient GND area due to trends toward downsizing and high density wiring of FPC. The FGF-500 can connect the FPC GND with external GND through the underlaying shielding film. Also, stable joint resistance is achieved due to the Au-plated outermost layer.
The FGF demonstrates its ability because the shield effectiveness can be improved by multi-point grounding of GND.
Use of the FGF enables wiring over the entire FPC.
Downsizing of the FPC is also expected.
When camera modules and B2B connectors to be installed in smartphones and other electronic devices are mounted on FPC, Ni-SUS and other metallic stiffeners are used, while on the other hand it is difficult to secure a sufficient GND area due to the trends toward downsizing and high density wiring of FPC in step with miniaturization of electronic devices. The FGBF-700 can bond the FPC and metallic stiffeners and connect the FPC GND with external GND through underlaying shielding films and metallic stiffeners.
●In the case where coverlay opening cannot be provided due to the narrow outer width of FPC
●In the case where no shielding film can be bonded in between due to the narrow stiffener spacing
● In the case where coverlay opening cannot be provided due to the large number of wiring of FPC