Thermosetting Conductive Bonding Film

WILMINA®
CBF®-300/-W6
CBF®-800-D40/-D60

UL 94 VTM-0 (when combined with Kapton® 200H) — CBF-800-D40/-D60 only
* Kapton® is a registered trademark of an affiliate of Qnity Electronics, Inc.

Product Overview

When camera modules or B-to-B connectors are mounted on an FPC in smartphones, a stiffener is bonded as a backing material. When a polyimide stiffener is used, the CBF series functions as a shield. When a metal stiffener such as Ni-SUS is used, it can provide a stable-resistance connection between the Ni-SUS and FPC GND. The CBF series offers excellent heat resistance and maintains stable performance after reflow. CBF-800-D40/-D60, in particular, provides excellent resistance to high-temperature and high-humidity environments.

Features

Excellent adhesion strength with various adherends

Provides excellent adhesion to metallic stiffeners and a wide range of other materials.
GND reinforcement

Electrically connects the FPC GND circuit to a metallic stiffener.
High-temperature and high-humidity resistance
(CBF-800-D40/-D60)

Maintains stable connection resistance after environmental testing at 85℃/85% RH.

Main specifications

Item		CBF®-300	CBF®-300-W6	CBF®-800-D40	CBF®-800-D60
Separator film thickness		38 µm	56 µm	50 µm	50 µm
Product thickness	Before pressing	40 µm	60 µm	40 µm	60 µm
Product thickness	After pressing	22 µm	42 µm	28 µm	45 µm
Adhesion strength	Adherend: Ni-SUS	10.0 N/cm or more	10.0 N/cm or more	10.0 N/cm or more	10.0 N/cm or more
Adhesion strength	Adherend: Polyimide	10.0 N/cm or more	10.0 N/cm or more	10.0 N/cm or more	10.0 N/cm or more
Shelf life (refrigerated)		4 months	4 months	5 months	5 months
Feature		Thin profile	Surface conformability	High humidity resistance & Thin profile	High humidity resistance & High conformability

Examples of Use

With a Ni-SUS stiffener

The FPC GND is connected to external GND through the Ni-SUS stiffener.
With a polyimide stiffener

The CBF functions as a shielding material.