EMI Suppression at Surface Steps
EMI Shielding Films for Rigid-Flex PCBs (High Step Conformability)

WILMINA®
SF-PC®6000-U1N2 / SF-PC®6000-U1-US

Overview

As electronic devices become smaller and more sophisticated, rigid-flex printed circuit boards (PCBs) are increasingly used in applications such as camera modules and automotive electronics. These boards have significant surface steps at the boundaries between rigid and flexible sections, requiring EMI shielding films with excellent step conformability.

TATSUTA’s WILMINA® SF-PC®6000-U1N2 and SF-PC®6000-U1-US are designed to conform to surface steps up to 400 µm. Unlike conventional shielding films that use a separate metal shielding layer, these products use an isotropic conductive adhesive that also provides the shielding function. This structure offers excellent step conformability while maintaining shielding effectiveness comparable to standard products such as SF-PC®5600-C.

SF-PC®6000-U1-US also offers resistance to chemicals used in ultrasonic cleaning processes, making it suitable for applications such as camera modules that require ultrasonic cleaning. Resistance is not guaranteed for all cleaning solutions.

  • ● Structure of SF-PC®5600-C

  • ● Structure of the SF-PC®6000 Series

  • Comparison of conventional shielding-film structure and high-step conformable shielding-film structure
    Structural comparison showing how eliminating the separate metal shielding layer improves step conformability
  • ● High-Temperature Storage Test (125 °C for 2,000 Hours)

    • Joint Resistance
      Joint resistance measurement results after high-temperature storage at 125 degrees Celsius for up to 2,000 hours
    • Peel Strength
      Peel strength measurement results after high-temperature storage at 125 degrees Celsius for up to 2,000 hours

* All data and numerical values shown above are measured results and are not guaranteed specifications.

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