High-Density FPC Routing
Free Grounding Film for EMI Shielding Films
FGF®-500
Free Grounding Bonding Film for EMI Shielding Films
FGBF®-700
Overview (FGF®-500)
Effective electromagnetic interference (EMI) shielding requires appropriate grounding, including multiple grounding points. However, as flexible printed circuits (FPCs) become smaller and wiring density increases, securing sufficient space for ground patterns becomes increasingly difficult. TATSUTA’s FGF®-500 provides an electrical connection between the FPC ground and external ground through the underlying EMI shielding film. Its gold-plated outer surface also helps ensure stable contact resistance.
Multi-point grounding helps improve shielding effectiveness, making FGF an effective solution.
Using FGF increases the available wiring area on an FPC.
It also enables more compact FPC designs.
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Conventional design: GND area on the FPC 
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With FGF: Larger wiring area 
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With FGF: Smaller FPC size 
Overview (FGBF®-700)
Metallic stiffeners, such as nickel-plated stainless steel (Ni-SUS), are commonly used when mounting camera modules and board-to-board (B-to-B) connectors on FPCs in smartphones and other electronic devices. However, as electronic devices become smaller and FPC wiring density increases, securing sufficient ground area and providing coverlay openings can become challenging. TATSUTA’s FGBF®-700 bonds the FPC to a metallic stiffener while establishing an electrical connection between the FPC ground and external ground through the underlying EMI shielding film and metallic stiffener. This eliminates the need for coverlay openings, supports high-density wiring, and helps simplify the assembly process.
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● When the FPC is too narrow to accommodate a coverlay opening
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● When the spacing between stiffeners is too narrow to apply a shielding film between them
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● When high wiring density leaves insufficient space for a coverlay opening
