UL94 V-0 (combined with Kapton200H)
* Kapton® is a registered trademark of DuPont in the U.S.
Product Overview
At the same time when a shielding film on FPC and a metallic stiffener are bonded, the FPC GND and external GND can be connected through the shielding film and metallic stiffener. Accordingly, this product can improve the degree of freedom in the design of FPC wiring, and because there is no need for coverlay opening, processes can be simplified and smoothness of FPC can be secured.
* We do not guarantee any combination with other products than TATSUTA-manufactured shielding films.
Features
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Enables connection with external GND through the shielding film and metallic stiffener
Enables high density wiring design of FPC. -
Enables across-the-board shield
Enables shield on the periphery of the stiffener because it can be bonded on the shielding film.
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Reduces surface roughness of FPC
Because there is no need for coverlay opening, roughness of the component mounting surface can be reduced.
Main specifications
| Item | FGBF-700 | |
|---|---|---|
| Total thickness (after press) | 23μm | |
| Peeling strength | vs. Ni-SUS | Over 5.0N/cm |
| vs. shielding film (TATSUTA-manufactured) | Over 3.0N/cm | |
| Shelf life (keep cool) | 6 months | |
Examples of Use
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In the case where coverlay opening cannot be provided due to the narrow outer width of FPC
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In the case where shielding film can not be bonded in between due to the narrow stiffener spacing
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In the case where coverlay opening cannot be designed due to the large number of wiring of FPC
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Differences in use method and area between the FGBF-700 and CBF series
Reference data
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Joint resistance value (Ni-SUS size: 5.0mm x 10.0mm)
