Product Overview
A pressure-sensitive conductive adhesive is used for this shielding tape.
With the use of the metallic thin film layer formed by our unique technology, we can propose products that meet various design requirements, including shield performance and thickness limits.
Features
-
Due to the adhesion tape specification, pressure bonding can be performed.
-
Optimum products can be selected according to various design requirements.
Main specifications
| Item | SF-CA55-10E | |
|---|---|---|
| Total thickness | 29um | |
| Protection layer | 6um | |
| Shielding layer | 10um | |
| Conductive adhesion layer | 13μm (anisotropic conductive) |
|
| Separator | 25um | |
| Peeling strength | Over 3.0N/25mm | |
| Shelf life (at room temperature) | 12 months | |
Examples of Use
-
Various electronic packaging devices mounting components (metal cans for IC packages, COF boards, COP boards, etc.)
* Adoption case for metal can
Reference data
-
Electric near filed shield effectiveness by KEC method
-
Electric near filed shield effectiveness by KEC method
* Above data and numerical values are all actual measurement values, not guaranteed values.
