EMI Shielding Film for High-Speed FPCs
(Standard / Ultrathin)

WILMINA®
SF-PC®8600-C
SF-PC®8900-C

UL 94: SF-PC8600(-C): V-0 / SF-PC8900(-C): VTM-0 (when combined with Kapton® 50H)
* Kapton® is a registered trademark of an affiliate of Qnity Electronics, Inc.

Product Overview

These shielding films use a silver-deposited structure to provide high shielding performance even in high-frequency applications. They combine shielding performance exceeding that of the standard SF-PC5600-C and SF-PC5900-C with the same workability as the standard products. They also maintain the same post-processing thickness as the standard products: 15 µm for SF-PC8600-C and 8 µm for SF-PC8900-C.

Features

High shielding performance

High shielding performance is achieved across high-frequency ranges.
SF-PC8600-C / SF-PC8900-C: 70dB or higher at 1GHz
High shielding performance
with an ultrathin 8 µm design (SF-PC8900-C)

SF-PC8900-C provides improved shielding performance while maintaining the same processability and 8 µm total thickness as the ultrathin standard product SF-PC5900-C.
Improved bendability

The shielding layer has been optimized to improve both shielding performance and bendability, making the products suitable for applications involving moving or sliding parts.

EMI Shielding Film for High-Speed FPCs<br> (Standard / Ultrathin)

Main specifications

Item		SF-PC®8600-C	SF-PC®8900-C
Transfer film thickness		57 µm	57 µm
Product thickness (after pressing)		15 µm	8 µm
Structure thickness (after pressing)	Protection layer thickness	5 µm	5 µm
	Shielding layer thickness	0.3 µm	0.3 µm
	Anisotropic conductive adhesive layer thickness	10 µm	3 µm
Adhesion strength	Adherend: Polyimide	3.0 N/cm or more	3.0 N/cm or more
Shelf life (refrigerated)		6 months	6 months