Product Overview
This shielding tape uses a pressure-sensitive conductive adhesive. Our proprietary thin-metal-film technology enables us to propose products that meet a wide range of design requirements, including shielding performance and thickness.
Features
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Pressure-sensitive adhesive for easy bonding
The pressure-sensitive adhesive enables bonding by pressure. -
Supports a wide range of design requirements
The product can accommodate various requirements for shielding performance and thickness.
Main specifications
| Item | SF-CA®55-10E | |
|---|---|---|
| Product thickness | 29 µm | |
| Structure thickness | Protection layer thickness | 6 µm |
| Shielding layer thickness | 10 µm | |
| Anisotropic conductive adhesive layer thickness | 13 µm | |
| Separator film thickness | 25 µm | |
| Adhesion strength | Adherend: Polyimide | 3.0 N/25 mm or more |
| Shelf life (at room temperature) | 12 months | |
Examples of Use
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Electronic devices and assemblies with mounted components
Example application: metal cans for IC packages, COF boards, and COP boards.
Reference data
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Electric near-field shielding effectiveness(KEC method)
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Magnetic near-field shielding effectiveness(KEC method)
* All data and numerical values shown above are measured values and are not guaranteed values.
