Non-Conductive Materials

Thermosetting Non-Conductive Bonding Film

NCBF-100-D25

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Product Overview

This non-conductive bonding film uses a thermosetting adhesive and provides excellent adhesion to a wide range of materials. It also maintains stable adhesive strength after 1,000 hours of reliability testing at 65℃/90% RH.

Features

  • Excellent adhesion

    Provides excellent adhesion to a wide range of materials.
  • Environmental reliability

    Maintains stable peel strength even after 1,000 hours at 65℃/90% RH.
Thermosetting Non-Conductive Bonding Film

Main specifications

Item NCBF-100-D25
Separator film thickness 38 µm
Product thickness (after pressing) Non-conductive adhesive layer thickness 25 µm
Adhesion strength Adherend: Polyimide 10.0 N/cm or more
Shelf life (at room temperature) 6 months

Reference data

  • Peel strength: 90° peel test

    Peel strength
  • Peel strength after environmental testing: 65°C/90% RH, 1,000 hours

    Peel strength after environmental testing: 65℃/90% RH, 1,000 hours

* All data and numerical values shown above are measured values and are not guaranteed values.

Download reference materials

NCBF資料(1900520-8_日)
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