Free ground bonding film (for shielding film)
UL94 V-0 (combined with Kapton200H)
* Kapton® is a registered trademark of DuPont in the U.S.
At the same time when a shielding film on FPC and a metallic stiffener are bonded, the FPC GND and external GND can be connected through the shielding film and metallic stiffener. Accordingly, this product can improve the degree of freedom in the design of FPC wiring, and because there is no need for coverlay opening, processes can be simplified and smoothness of FPC can be secured.
* We do not guarantee any combination with other products than TATSUTA-manufactured shielding films.
Enables connection with external GND through the shielding film and metallic stiffenerEnables high density wiring design of FPC.
Enables across-the-board shieldEnables shield on the periphery of the stiffener because it can be bonded on the shielding film.
Reduces surface roughness of FPCBecause there is no need for coverlay opening, roughness of the component mounting surface can be reduced.
|Total thickness (after press)||23μm|
|Peeling strength||vs. Ni-SUS||Over 5.0N/cm|
|vs. shielding film (TATSUTA-manufactured)||Over 3.0N/cm|
|Shelf life (keep cool)||6 months|
Examples of Use
In the case where coverlay opening cannot be provided due to the narrow outer width of FPC
In the case where shielding film can not be bonded in between due to the narrow stiffener spacing
In the case where coverlay opening cannot be designed due to the large number of wiring of FPC
Differences in use method and area between the FGBF-700 and CBF series