Free grounding film (for shielding film)
UL94 V-0 (combined with Kapton50H)
* Kapton® is a registered trademark of DuPont in the U.S.
As the conductive fillers contained in the conductive adhesive contact the shielding layer of the shielding film, FPC GND can be drawn out externally. Also, stable joint resistance is achieved due to the Au-plated outermost layer.
* We do not guarantee any combination with other products than TATSUTA-manufactured shielding films.
Enables drawing out GND
from any place on the shielding filmGND for external connection can be secured in the FPC wiring area.
Enables high-density wiring of boards
Achieves ultra-thinness of 12μm in total thickness (FGF-500)
Compatible with small areas (FGF-800)
|Thickness Reinforcing film (blue)||64μm||64μm|
|Total thickness (after press)||12μm||16μm|
(The outermost layer is Au-plated.)
|About 0.5μm||About 0.5μm|
|Cu foil layer||6μm||6μm|
|Anisotropic conductive adhesion layer||6μm||10μm|
| Joint resistance value
* FGF size: 10mm x 5mm
|Under 1.0Ω||Under 1.0Ω|
|Peeling strength||Over 3.0N/cm||Over 3.0N/cm|
|Shelf life (keep cool)||6 months||6 months|
Examples of Use
* Above data and numerical values are all actual measurement values, not guaranteed values.
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