Thermal setting non-conductive bonding film
A thermal setting adhesive is used for this non-conductive bonding film. Demonstrates excellent adhesiveness to various materials. Our unique technology achieves a product thickness of 8μm, contributing to the realization of thinning boards. According to FPC design, you can select from 8µm or 25µm product.
Product thicknessIndustry’s thinnest bonding film (8μm).
Excellent adhesivenessEnables bonding to various materials.
Environmental test resistanceOffers stable peeling strength even after environmental test at 65℃ and 90% for 1,000 hours.
|Thickness Non-conductive adhesion layer||8μm||25μm|
|Peeling strength (N/cm)||Ni-SUS||12||15|
|Shelf life (at room temperature)||6 months||6 months|