Conductive adhesive

Thermal setting conductive bonding film

WILMINA®
CBF®300/-W6
CBF®800-D40/-D60

  • SP
  • PC/Tablet
  • AUTO
  • TV
  • Other

UL94 VTM-0 (combined with Kapton200H) * CBF-800-D40/-D60
* Kapton® is a registered trademark of DuPont in the U.S.

Product Overview

When smartphone camera modules or B2B connectors are mounted on FPC boards, stiffeners are bonded as a backing material. When polyimide stiffeners are used, the CBF series functions as a shield, and when Ni-SUS or other metallic stiffeners are used, Ni-SUS and FPC GND can be connected with a stable resistance value. The CBF series also offers stable performance after reflowing due to the excellent heat resistance. In particular, the CBF-800-D40/-D60 is superior in high temperatures and humidity resistance.

Features

  • Excellent peeling strength in response to various base materials

    Offers excellent peeling strength in response to metallic stiffeners and various other adherends.
  • Strengthening of GND

    Enables electrically connecting FPC GND circuits and metallic stiffeners.
  • High temperatures and humidity resistance (CBF-800-D40/-D60)

    Maintains a stable resistance value during environmental test at 85℃ and 85%Rh.
Thermal setting conductive bonding film

Main specifications

Item CBF-300 CBF-300-W6 CBF-800-D40 CBF-800-D60
Product thickness (after press) 22μm 42μm 28μm 45μm
Peeling strength vs. Ni-SUS Over 10N/cm
vs. polyimide Over 10N/cm
Shelf life (keep cool) 4 months 5 months
Features Thin Step-compatible High humidity resistance
Thin
High humidity resistance
Step-compatible

Examples of Use

  • In the case of Ni-SUS stiffener
    The FPC GND is connected to
    external GND through Ni-SUS.

  • In the case of polyimide stiffener
    The CBF functions as a shield.

Reference data

  • Electric near filed shield effectiveness by KEC method

    Electric near filed shield effectiveness by KEC method
  • Magnetic near filed shield effectiveness by KEC method

    Magnetic near filed shield effectiveness by KEC method
  • 85℃, 85%Rh, 1,000 hours; Reliability test (CBF-800-D60)

  • 【Joint resistance value】

    【Joint resistance value】
  • 【Peeling strength (vs. Ni-SUS)】

    【Peeling strength (vs. Ni-SUS)】

* Above data and numerical values are all actual measurement values, not guaranteed values.

Download reference materials

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