Thermal setting conductive bonding film
UL94 VTM-0 (combined with Kapton200H) * CBF-800-D40/-D60
* Kapton® is a registered trademark of DuPont in the U.S.
When smartphone camera modules or B2B connectors are mounted on FPC boards, stiffeners are bonded as a backing material. When polyimide stiffeners are used, the CBF series functions as a shield, and when Ni-SUS or other metallic stiffeners are used, Ni-SUS and FPC GND can be connected with a stable resistance value. The CBF series also offers stable performance after reflowing due to the excellent heat resistance. In particular, the CBF-800-D40/-D60 is superior in high temperatures and humidity resistance.
Excellent peeling strength in response to various base materialsOffers excellent peeling strength in response to metallic stiffeners and various other adherends.
Strengthening of GNDEnables electrically connecting FPC GND circuits and metallic stiffeners.
High temperatures and humidity resistance (CBF-800-D40/-D60)Maintains a stable resistance value during environmental test at 85℃ and 85%Rh.
|Product thickness (after press)||22μm||42μm||28μm||45μm|
|Peeling strength||vs. Ni-SUS||Over 10N/cm|
|vs. polyimide||Over 10N/cm|
|Shelf life (keep cool)||4 months||5 months|
|Features||Thin||Step-compatible||High humidity resistance
|High humidity resistance
Examples of Use
Electric near filed shield effectiveness by KEC method
Magnetic near filed shield effectiveness by KEC method
85℃, 85%Rh, 1,000 hours; Reliability test (CBF-800-D60)
【Joint resistance value】
【Peeling strength (vs. Ni-SUS)】
* Above data and numerical values are all actual measurement values, not guaranteed values.
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