Product Overview
This masking tape offers excellent heat resistance with little adhesive residue. It is ideal for preventing contamination of Au-plated terminals during solder paste printing and reflowing (also compatible with lead-free solder).
Features
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Compatible with lead-free solder reflows
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Adherends are not contaminated
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The tape can be cut at any desired position
Main specifications
| Item | RPT-150 |
|---|---|
| Thickness Heat resistant resin | 30μm |
| Thickness Heat resistant adhesive | 10μm |
| Total thickness | 40μm |
| Thickness Separator | 75μm |
| Shelf life (at room temperature) | 12 months |
Reference data
| Item | Measurement value | |
|---|---|---|
| Breaking strength ＊1 | Before reflowing | 10N |
| After five reflows | 9N | |
| Peel force (adhesive force) ＊2 | Before reflowing | 0.16N/cm |
| After five reflows | 0.81N/cm | |
| Staining property (Au-plated terminal)＊3 | Before reflowing | 34dyne/cm |
| After five reflows | 32dyne/cm | |
*1 Tensile testing machine: Minebea’s PT200N; sample width: 10mm; pulling rate: 300mm
*2 Machine, sample, and test conditions are the same as *1; adherend: Au-plated sheet
*3 Wettability test in accordance with JIS K 6768 (reagent manufactured by Wako Pure Chemical Industries)
* Above data and numerical values are all actual measurement values, not guaranteed values.
