Grounding Solutions

Free Grounding Film with Non-Conductive Adhesive

NFGF-100

  • SP
  • PC/Tablet
  • AUTO
  • TV
  • Other

UL 94 V-0 (when combined with Kapton® 50H)
* Kapton® is a registered trademark of an affiliate of Qnity Electronics, Inc.

Product Overview

By bonding NFGF-100 at the location where GND is required and covering the surrounding area with shielding film, the FPC GND can be connected to external GND. Its flexing durability also makes it suitable for providing GND at FPC bending sections.

Features

  • Enables GND connection at the desired location on an FPC

    Provides an external GND connection within the FPC wiring area through the shielding film.
  • Enables high-density FPC wiring

Free Grounding Film with Non-Conductive Adhesive

Main specifications

Item NFGF-100
Reinforcing film thickness 64 µm
Product thickness (after pressing) 15 µm
Structure thickness (after pressing) Surface treatment layer thickness Approx. 0.5 µm
Thin metal layer thickness 6 µm
Non-conductive adhesive layer thickness 9 µm
Joint resistance 1.0 Ω or less
Adhesion strength Adherend: Polyimide 3.0 N/cm or more
Shelf life (refrigerated) 6 months

Examples of Use

  • Top view

    Top view
  • Cross-sectional view

    Cross-sectional view

Reference data

  • 180° folding test results

    180° folding test results

* All data and numerical values shown above are measured values and are not guaranteed values.

Related Products

Download reference materials

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