UL 94 V-0 (when combined with Kapton® 200H)
* Kapton® is a registered trademark of an affiliate of Qnity Electronics, Inc.
Product Overview
This product bonds a metal stiffener to the shielding film on an FPC while enabling connection between the FPC GND and external GND through the shielding film and metal stiffener. This increases flexibility in FPC routing design. Because no coverlay opening is required, the product also helps simplify the process and maintain a flat FPC surface.
* Performance is not guaranteed when used in combination with shielding films other than those manufactured by TATSUTA.
Features
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Enables connection to external GND through the shielding film and metallic stiffener
Supports high-density FPC wiring designs. -
Enables continuous shielding around the stiffener
Because FGBF-700 can be bonded directly onto the shielding film, shielding can be maintained around the perimeter of the stiffener. -
Reduces surface unevenness of the FPC
Eliminating the need for a coverlay opening helps reduce unevenness on the component-mounting surface.
Main specifications
| Item | FGBF®-700 | |
|---|---|---|
| Separator film thickness | 50 µm | |
| Product thickness (after pressing) | 23 µm | |
| Adhesion strength | Adherend: Shielding film (manufactured by TATSUTA) |
3.0 N/cm or more |
| Shelf life (refrigerated) | 6 months | |
Examples of Use
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When the FPC is too narrow to provide a coverlay opening
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When the spacing between stiffeners is too narrow to apply shielding film between them
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When the number of FPC traces makes it difficult to provide a coverlay opening
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Comparison of application methods and areas between FGBF-700 and the CBF series
Reference data
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Joint resistance
(Ni-SUS size: 5.0 mm × 10.0 mm)
* All data and numerical values shown above are measured values and are not guaranteed values.
