UL 94 V-0 (when combined with Kapton® 50H)
* Kapton® is a registered trademark of an affiliate of Qnity Electronics, Inc.

Product Overview
Conductive particles in the conductive adhesive contact the shielding layer of the shielding film, enabling the FPC GND to be brought out for external connection. In addition, gold plating on the outermost layer provides stable connection resistance.
*Performance is not guaranteed when used in combination with shielding films other than those manufactured by TATSUTA.
Features
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Enables GND connection at any location on the shielding film
Provides an external GND connection within the FPC wiring area. -
Enables high-density FPC wiring
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Ultrathin 12 µm design (FGF-500)
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Suitable for small mounting areas (FGF-800)

Main specifications
| Item | FGF®-500 | FGF®-800 | |
|---|---|---|---|
| Reinforcing film thickness | 64 µm | 64 µm | |
| Product thickness (after pressing) | 12 µm | 16 µm | |
| Structure thickness (after pressing) | Surface treatment layer thickness | Approx. 0.5 µm | Approx. 0.5 µm |
| Thin metal layer thickness | 6 µm | 6 µm | |
| Anisotropic conductive adhesive layer thickness | 6 µm | 10 µm | |
| Joint resistance (FGF size : 10 mm × 5 mm) | 1.0 Ω or less | 1.0 Ω or less | |
| Adhesion strength | Adherend : TATSUTA Shielding film |
3.0 N/cm or more | 3.0 N/cm or more |
| Shelf life (refrigerated) | 6 months | 6 months | |
Examples of Use
Using FGF allows the FPC area to be used more efficiently for wiring, enabling smaller FPC designs. It also enables multiple GND connection points for high-density wiring and improved shielding performance.
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Conventional design — GND formed on the FPC
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With FGF — Larger wiring area at the same FPC size
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With FGF — Smaller FPC with the same wiring area
* All data and numerical values shown above are measured values and are not guaranteed values.
Related Products
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