Product Overview
These are heat-seal-type (thermoplastic) electromagnetic shielding films. Thin-film formation technology enables a reduced total product thickness. Their lightweight design and excellent flexibility make them suitable for shielding portable devices and various types of wiring. They are widely used as shielding materials for flexible flat cables in consumer electronics and televisions. In response to demand for higher reliability, SF-FC500, which provides heat resistance up to 125°C, is seeing increasing adoption in automotive applications.
Features
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Lightweight and highly flexible (SF-FC700)
The thin, lightweight design provides excellent flexibility. -
Low-temperature, short-time bonding
The thermoplastic conductive adhesive enables easy bonding to a variety of substrates. -
Excellent shielding performance
SF-FC700 uses a metallic thin-film shielding layer to provide excellent shielding performance.
SF-FC500 uses 10µm aluminum foil for even higher shielding performance. -
High heat resistance (SF-FC500)
Provides heat resistance at 125°C to meet the requirements of automotive applications.
Main specifications
| Item | SF-FC700 | SF-FC500 | |
|---|---|---|---|
| Product thickness (after pressing) | 29 µm | 45 µm | |
| Structure thickness (after pressing) | Base film thickness | 9 µm | 15 µm |
| Shielding layer thickness | 0.1 µm | 10 µm | |
| Anisotropic conductive adhesive layer thickness | 20 µm | 20 µm | |
| Separator film thickness | 40 µm | 40 µm | |
| Adhesion strength | Adherend: PET | 3.0 N/cm or more | 3.0 N/cm or more |
| Shelf life (at room temperature) | 6 months | 6 months | |
Examples of Use
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Car navigation systems
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Automotive displays
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Video game consoles
Reference data
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Electric-field shielding effectiveness
(KEC method)
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Magnetic-field shielding effectiveness
(KEC method)
-
Adhesion strength at 125℃
-
Joint resistance at 125℃
* All data and numerical values shown above are measured values and are not guaranteed values.
